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The Newly Upgraded Chip of Brand Core
high-speed computing; high-performance,32-bit frequency: 168M; Cortex-M4 CPU with FPU and DSP instruction, memory protection unit
Don't need manual leveling, the intelligent leveling system can automatically adjust the uneven hotbed. High-sensitivity sensor, 16-point precise leveling.
Use TMC Stepper Motor Drivers,Super Quiet and Noise Reduction,running more stable,≤50dB silent printing.
Glass Heat Bed
The 4th generation of glass heat bed cold glue installation, easy to take the model and scratch proof.
Dual Cooling Fans
The printing head adopts a double fan two-way heat dissipation system, cools down models rapidly. The printing speed is faster which can reach 100mm/s.
Double Gears Direct Extrusion
Conveying material uniform without winding
DetectionBroken material can be automatically detected
Support SD card, USB, and USB-C supports online printing
Dual Z-Axis with Synchronous Belt
Improve the accuracy, keep the "layer shift" away.
Belt Tensioner on X/Y Axis
Adjust the belt tightness to avoid long-term use of the printer, the belt is loose.
3.5" Large Touch Screen
The screen adopts a new UI interface, manipulate photos, and switch in multiple languages. New interface; large screen; simple operation.
|Specification|| Print Parameters: FDM ( Fused Deposition Modeling)
Build Volume: 230(L)x230(W)x260(H)mm
Print Resolution: 0.1mm
Positioning Accuracy: X/Y 0.0125mm, Z 0.002mm
Extruder Number: Single
Nozzle Diameter: 0.4mm
Print Speed: <200mm/s (recommended 60 - 80mm/s)
Support Filaments: PLA, TPU, ABS
Software Parameters: Cura
Input Formats: .STL, .OBJ, .AMF
Output Formats: GCODE
Connection Mode: SD Card, U Disk, USB-C
Input Voltage: 100/240 V AC, 60/50Hz
Output Voltage: 24V/14.6A (350W)
Ambient Operating Temperature: 5+C - 40+C
Operational Nozzle Temperature: max 260+C
Operational Hot Bed Temperature: max 110+C
|Weight & Size||Product Weight: 9.4kg
Package Weight: 10kg
Product Size(L x W x H): 555x430x660mm
Package Size(L x W x H): 500x43x20.3mm
1 x Filament
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